multilayer ceramic chip capacitors 1 of 3 creation date : june 30, 2017 (gmt) cga5l1x5r1c106m160ac tdk item description cga5l1x5r1c106mt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga5(3216) [eia 1206] status production (not recommended for new design) size length(l) 3.20mm +0.30,-0.10mm width(w) 1.60mm +0.30,-0.10mm thickness(t) 1.60mm +0.30,-0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 10f 20% rated voltage 16vdc temperature characteristic x5r(15%) dissipation factor (max.) 5% insulation resistance (min.) 10m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 30, 2017 (gmt) cga5l1x5r1c106m160ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga5l1x5r1c106m160ac esr cga5l1x5r1c106m160ac capacitance cga5l1x5r1c106m160ac dc bias characteristic cga5l1x5r1c106m160ac temperature characteristic cga5l1x5r1c106m160ac(no bias) cga5l1x5r1c106m160ac(dc bias = 8v ) ripple temperature rising cga5l1x5r1c106m160ac(100khz) cga5l1x5r1c106m160ac(500khz) cga5l1x5r1c106m160ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 30, 2017 (gmt) cga5l1x5r1c106m160ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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